Intel's SoC plans
Intel executives have outlined a plan to use the company’s chip design knowledge, factory capacity, manufacturing techniques and the economics of Moore’s Law to usher in a category of highly integrated, purpose-built and Web-savvy ’System on Chip’ (SoC) designs and products.
The company has also unveiled eight such products under the Intel EP80579 Integrated Processor family for security, storage, communications, and industrial robotics.
Intel says that it is architecting several of these SoC chip designs based on the same blueprint as the company’s existing processors that run the bulk of the Internet, called Intel architecture (IA). The products will offer performance and energy efficiency versus traditional SoCs, combine multiple functions, and will be customised to target the company’s traditional computing businesses and growth areas across Consumer Electronics (CE), Mobile Internet Devices (MIDs) and embedded markets, the company adds.
Intel has more than 15 SoC projects planned internally, including the company’s first Consumer Electronics (CE) chip, codenamed "Canmore", scheduled for introduction later this year, and the second-generation "Sodaville", which is scheduled for next year.
In addition, Intel’s second-generation embedded product line is scheduled to arrive in 2009, with Intel’s next-generation platform for Mobile Internet Devices code-named "Moorestown" and featuring "Lincroft," scheduled for release by 2010. Many of these products will be based on the Intel Atom processor core.
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