Superfast USB 3.0
Intel yesterday released the draft specification for USB 3.0, the next generation USB interface. The specifications will allow other chipset manufacturers to develop hardware compatible with USB 3.0.
USB 3.0, also known as SuperSpeed USB, promises transfer speeds of up to 5Gb/s using the new technology.
With this version of the draft – version 0.9 – in place chances are strong that initial releases of USB 3.0 compatible hardware will become available in mid-2009. Widespread use of USB 3.0 will probably only happen in early 2010.
"The future of computing and consumer devices is increasingly visual and bandwidth intensive," said Phil Eisler, AMD corporate vice president and general manager of the Chipset Business Unit. "Lifestyles filled with HD media and digital audio demand quick and universal data transfer. USB 3.0 is an answer to the future bandwidth need of the PC platform. AMD believes strongly in open industry standards, and therefore is supporting a common xHCI specification."
Microsoft also welcomed the release saying this was a "huge step forward … for exciting new functionality and usages."
Version 0.95 of the USB 3.0 specification will be made available towards the end of this year.
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