Samsung has begun mass production of the Exynos 7 Dual 7270.
It is the first mobile application processor (AP) in its class to feature full connectivity and an LTE modem, said Samsung.
The chip was designed for wearable devices, with Samsung adding that it is the first AP made using a 14-nanometre FinFET process.
“The Exynos 7270 presents a new paradigm for system-on-chips (SoC) dedicated to wearables,” said Ben K. Hur, vice president of System LSI Marketing at Samsung Electronics.
“Designed on our state-of-the-art process technology, this AP offers great power savings, 4G LTE modem and full connectivity solution integration, as well as innovative packaging technology optimised for wearable devices.”