Intel executive, Patrick Gelsinger, has given a variety of updates on Intel’s work with the industry on the company’s processors, surrounding technologies and "tick-tock" design cadence, including details on Intel’s upcoming 45nm products.<\/p>\n
He also discussed the industry’s recent moves in energy efficient computing, virtualisation, broad range of software enabling, as well as recent system architecture initiatives spanning the USB interconnect to upcoming lead-free products for the company’s Intel vPro desktop PCs. <\/p>\n
"Intel’s development model and cadence is a predictive, efficient and effective way to deliver products and to provide the industry with an exciting computing roadmap in our relentless pursuit of Moore’s Law," says Gelsinger, senior vice-president and GM of Intel’s Digital Enterprise Group, at the Intel Developer Forum in San Francisco.<\/p>\n
"In addition to our processors, we are focused on delivering energy efficiency via design of better, Hafnium-based High-k transistors as well as enhancements in overall system level architecture to minimise the computer’s energy usage."<\/p>\n
During his speech, Gelsinger showed the first Intel 45nm High-k metal gate next-generation microarchitecture (Nehalem) dual processor server, which is designed to use the element hafnium instead of silicon in portions of the 700m-plus transistors inside the processor die, which is about the size of a postage stamp.<\/p>\n
Nehalem is the code name of a processor microarchitecture arriving in 2008 that is intended to provide up to three times the peak memory bandwidth of current competing processors. He also showed broad industry support for the Intel QuickPath Architecture. The QuickPath Interconnect provides high-speed data paths to Nehalem’s processor cores.<\/p>\n
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