Single-Chip HSPA Processor
Broadcom Corporation announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.
Broadcom's new "3G Phone on a Chip" solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions – driving widespread consumer adoption.
“Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology,” the company says.
Advancements in mobile phone designs, such as the proliferation of extensive Internet applications and web services, multimedia, high resolution video and still cameras, games and music, are driving a growing demand for faster cellular networks and an appetite for rich multimedia phones that can take advantage of them.
HSUPA is often considered the ultimate cellular modem technology. There are already over 900 million subscribers in HSPA enabled networks today, and many network operators are planning massive worldwide deployment of HSUPA over the next several years.
Using phones enabled by the new Broadcom HSUPA processor, consumers will be able to download content at up to 7.2 Megabits per second (Mbps), and upload content such as pictures and videos at up to 5.8Mbps, all directly from their phone.
HSUPA technology also holds the promise for much higher quality "live" video conferencing and an array of exciting services and applications.
"Broadcom has already demonstrated commercial success with its EGPRS single-chip solution and multi-chip 3G solutions," commented Michael Thelander, CEO and Founder of Signals Research Group, LLC.
"With this single chip solution, Broadcom is becoming a one-stop supplier of 3G/2G, Wi-Fi and Bluetooth silicon solutions and communications software, positioning it to leapfrog many of its competitors from both a technology and market share perspective."
"With what we believe is more than a full year's lead over similar competing products, this new 3G solution should place Broadcom squarely at the head of the hyper-competitive 3G chip race," said Yossi Cohen, Senior Vice President and General Manager of Broadcom's Mobile Platforms Group.
"We built upon the success of our single-chip EDGE solution and merely eight months later our engineers not only built a single chip HSUPA solution, but also integrated Bluetooth, FM radio, and the next level of multimedia. This is truly amazing engineering execution, a hallmark of Broadcom. Our investments in multi-modal CMOS RF and high definition multimedia technologies will further widen our mobile technology leadership in the coming years."
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