The next HoloLens will have a deep-learning chip

Microsoft said the next iteration of its HoloLens AR headset will include a deep-learning coprocessor.

The company designed and built its own custom multiprocessor called the Holographic Processing Unit (HPU) for its mixed-reality device.

The HPU processes information from onboard sensors – such as inertial measurement, head tracking, and infrared tracking.

Microsoft’s HPU chip will also include an AI coprocessor, which will natively implement Deep Neural Networks, improving recognition accuracy.

The chip supports a wide variety of layer types which are fully programmable by Microsoft.

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The next HoloLens will have a deep-learning chip