Intel has advanced its chip manufacturing technology with three-dimensional transistors that could make PCs, smartphones and tablets faster and more power-efficient.
The company said Wednesday that it will implement three-dimensional transistors when making chips using its latest 22-nanometer manufacturing technology.
The new chip technology, called tri-gate transistors, replaces flat, two-dimensional streams of transistors with a 3D structure, said Mark Bohr, an Intel senior fellow. A flat, two-dimensional planar gate is replaced with a thin, three-dimensional fin that rises up vertically from the silicon substrate.
The technology will allow Intel to create transistors that are faster, smaller and more power-efficient, Bohr said. The benefits of the new technology will range across the product lines from the fastest server to the most power-efficient smartphone chips made by Intel.
