Thats what I was checking for. I got a round circle but not big enough to cover the top of the cpu. When I added more the circle stayed about the same size but it was thicker which is not the desired result. Dunno why it did not spread more but then again this paste is pretty thick in consistancy.
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Operation CPU & HS lapping
- Thread starter ponder
- Start date
Thats what I was checking for. I got a round circle but not big enough to cover the top of the cpu. When I added more the circle stayed about the same size but it was thicker which is not the desired result. Dunno why it did not spread more but then again this paste is pretty thick in consistancy.
Guys I updated the first post with the results. Well worth the R45 I spent on sandpaper.
Pinky: Brain, what are we doing tomorrow night?
Brain: Pinky, we are going to OC this sucker!
Pinky: OC?
Brain:
Pinky: Brain, what are we doing tomorrow night?
Brain: Pinky, we are going to OC this sucker!
Pinky: OC?
Brain:
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Now wait for the paste to cure and it should get better.Arthur
Honorary Master
Just to corroborate Penguin's post about thermal interface materials (TIMs):
* Thermal compound is much worse at heat transfer than metal-to-metal contact.
* The whole reason why one uses a thermal interface material is because even on mirror-smooth surfaces, the real metal-to-metal contact at a molecular level is only around 4-6% - most of the 'contact' area is actually air spaces if looked at under a microscope. Thermal compound is designed to fill those microscropic airspaces with a solid (eg micronised silver in Arctic Silver, or 'liquid metal' such as Coollaboratory's Liquid Pro).
* A common error is using too much TIM (compound). It should be really thin but cover the entire contact area. Spreading and scraping with a credit card is a good idea and suggested by many experts. So, using too much TIM can cause the HS to 'float', reducing or even eliminating metal-to-metal contact, which can cause serious overheating problems. I've seen innumerable overheating systems over the years where simply reducing the TIM by 95% has fixed the problem.
* Good TIMs like Arctic Silver 5 take a while to 'bed in'. AS5 contains micronised silver particles (it is these metal particles that do the hear transfer, not the pasty stuff - that's just a transport for the silver). Basically, each heat-cool cycle causes the paste to melt and seep in deeper into the microscopic gaps between the HS and CPU backplate, taking the little silver particles with it and making more metal-to-metal contact. That's why it takes a while for AS5 to 'cure' - it improves over time. It's also why taking the HS off at regular intervals is less than ideal.
* Even lapped, polished, honed and buffed cold plates makes <10% metal-to-metal contact; you still need a good TIM.
On my air-cooled systems I've been using Coollaboratory's Liquid Pro for years. Amazing stuff. Expensive but well worth the price in dramatically improved heat trasnfer My liquid cooled systems use AS5.
* Thermal compound is much worse at heat transfer than metal-to-metal contact.
* The whole reason why one uses a thermal interface material is because even on mirror-smooth surfaces, the real metal-to-metal contact at a molecular level is only around 4-6% - most of the 'contact' area is actually air spaces if looked at under a microscope. Thermal compound is designed to fill those microscropic airspaces with a solid (eg micronised silver in Arctic Silver, or 'liquid metal' such as Coollaboratory's Liquid Pro).
* A common error is using too much TIM (compound). It should be really thin but cover the entire contact area. Spreading and scraping with a credit card is a good idea and suggested by many experts. So, using too much TIM can cause the HS to 'float', reducing or even eliminating metal-to-metal contact, which can cause serious overheating problems. I've seen innumerable overheating systems over the years where simply reducing the TIM by 95% has fixed the problem.
* Good TIMs like Arctic Silver 5 take a while to 'bed in'. AS5 contains micronised silver particles (it is these metal particles that do the hear transfer, not the pasty stuff - that's just a transport for the silver). Basically, each heat-cool cycle causes the paste to melt and seep in deeper into the microscopic gaps between the HS and CPU backplate, taking the little silver particles with it and making more metal-to-metal contact. That's why it takes a while for AS5 to 'cure' - it improves over time. It's also why taking the HS off at regular intervals is less than ideal.
* Even lapped, polished, honed and buffed cold plates makes <10% metal-to-metal contact; you still need a good TIM.
On my air-cooled systems I've been using Coollaboratory's Liquid Pro for years. Amazing stuff. Expensive but well worth the price in dramatically improved heat trasnfer My liquid cooled systems use AS5.
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SirFooK'nG
Executive Member
My PC room was so cold last night that I didnt even go over 40C at full load! + I'm OC'd to 3.0ghz
rudirautenbach
Senior Member
I r require pictures of AMG.
I can like to post, but I are unsure how I can like to should post here?
PostmanPot
Honorary Master
Guys I updated the first post with the results. Well worth the R45 I spent on sandpaper.
Pinky: Brain, what are we doing tomorrow night?
Brain: Pinky, we are going to OC this sucker!
Pinky: OC?
Brain:
Nice results.
Load results...?
SirFooK'nG
Executive Member
Yeah, but not all chips are equall! I got to a stable 3.4ghz on air, but didnt like the temps and voltages required. And given I run crysis at max settings (1920X1080) @3.0ghz, I figured its a good enough clock. Running the 64bit now, and loving it!
I was thinking of getting this stuff. How easy is it to use and what are the things to look out for? I understand it corrodes/eats aluminium. Take it then that it is safe on copper and steel.
The Corsair H50 might be a problem with it since no-one seems to know if the base screws are aluminium.
Arthur
Honorary Master
It's not quite as mercurial as mercury, but it can run easily, so take care when applying. And yes, keep away from aluminium! Don't get it anything else 'cause it's conductive. clicktey-click.
First value is at idle, second value to the right is at 100% load.
Al temps in degrees centigrade.
I see alot of people apply this by spreading as opposed to letting the heatsink pressure spread it.
I'll need to check on the cooler I want to get and see if the screws it has is aluminium or steel. Otherwise, back to AS5.
PostmanPot
Honorary Master
I ended up spreading the AS5 last night as I got a much thinner layer than what happens from pressure.
http://www.ocia.net/reviews/liquidpro/page4.shtml
AS5 vs Liquid Pro. Looks to me like this guy when ape**** on the LP application. To me it seems like way too much. The final test results seem to show this as everywhere else this Liquid Pro comes up trumps.
AS5 vs Liquid Pro. Looks to me like this guy when ape**** on the LP application. To me it seems like way too much. The final test results seem to show this as everywhere else this Liquid Pro comes up trumps.
dudewotevr
Expert Member
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Awesome results dude!
