I can never have enough test equipment to bugger around with, so I am always building new machines for testing; especially when all our test kit is out on loan. The latest one, Gaddafi, was idling at around 70 degrees, and was shutting down under load. Turns out one of the plastic cooler clips was broken, and thus not securing the heat sink correctly.
I replaced the Intel with an old AMD cooler, using cable ties to secure it (Gaddafi is ugly as sin, if there was ever a competition for the biggest load of crap PC-this on would win!). Now it idles at 35 peaks at 85. I did not use any thermal compound, I don't have any handy. How much will the temp come down with the compound? Is 85 too high? If the compound reduces the heat by 3-5 degrees then I could not be bothered with undoing the cable ties for such a small gain....
Oh, its a P4 3.0....
I replaced the Intel with an old AMD cooler, using cable ties to secure it (Gaddafi is ugly as sin, if there was ever a competition for the biggest load of crap PC-this on would win!). Now it idles at 35 peaks at 85. I did not use any thermal compound, I don't have any handy. How much will the temp come down with the compound? Is 85 too high? If the compound reduces the heat by 3-5 degrees then I could not be bothered with undoing the cable ties for such a small gain....
Oh, its a P4 3.0....
