Applying CPU Thermal paste: X-method??

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nakedpeanut

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I was busy reading about a budget build to run Fallout 4, and the the author states:
"it’s been widely shown that an ‘X’ shape of two thin lines is the best way to apply it"​
fallout4-pc-2-1200x800.jpg
Looks like lots of overrun!

I'm more of the dot in the middle type guy, sometimes doing the full spread with a credit card if i feel like it..
Doing a bit of research it looks like the x-method actually works quite well! I'm starting to rethink how I apply thermal paste!

pic_disp.php
 
Less than 2°C between all methods? I'd say that means you can do whatever you want. Between the application of thermal paste, the variance of pressure on the mount and just plain luck you are bound to have a maximum accuracy of ±1°C
 
The purpose of the thermal paste is to reduce the thermal resistance between the device and the heatsink.
Fancy patterns, would have been known years ago because remember, thermal paste is decades old, and was used with transistors originally.

In engineering, uniform application of the paste layer, is the key thing.

Using patterns likely leads to uneven spread. Application with a purpose-made squeegee is likely your best bet.

In factories, in some cases, the paste is printed on with a screen, leaving a uniformly thick, square
 
If the temps bother you someone on Carbonite is offering the service of Ultracooling your CPU, which means he removes the CPU lid and removes the Intel thermal paste and applies proper performance thermal paste, which easily drops your temps by 20°C.

liquidprospread_zps725ef9d0.jpg
 
1441568916 said:
The purpose of the thermal paste is to reduce the thermal resistance between the device and the heatsink.
Click to expand...

That is not quite correct
Metal on metal contact is far superior to any paste out there. The paste is there to fill the holes where metal on metal contact is not occurring, ie where there would have been metal, then air, then metal.
 
Archer said:
That is not quite correct
Metal on metal contact is far superior to any paste out there. The paste is there to fill the holes where metal on metal contact is not occurring, ie where there would have been metal, then air, then metal.
Click to expand...

You are wrong. However let's just leave it at that, I don't have the time or cash on hand to prove you wrong, at this time of year.
 
Archer said:
That is not quite correct
Metal on metal contact is far superior to any paste out there. The paste is there to fill the holes where metal on metal contact is not occurring, ie where there would have been metal, then air, then metal.
Click to expand...

What your saying is correct, but by filling the voids, you are reducing the thermal resistance between the device and the heatsink, so 144* is indeed correct.
 
DrJohnZoidberg said:
I call bs on that number. Why would Intel, the largest desktop CPU manufacturer, not already just be doing this? 20C is a massive number! I'd maybe believe it if you said 2C maybe.
Click to expand...

I know this is the internet but I wouldn't lie to you, you can just Google CPU delid results, the numbers are there.
 
Yes delidding is a whole other topic, but it does drop the temps quite drastically!

From the vid it looks like even coverage is much easier to achieve with the x method. It still looks like too much thermal paste to me, but then again I agree with Archer, ±1°C is nothing really.
 
I just spread a thin layer over the entire surface of the cpu, always have.

I have never had heat issues.
 
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